SMVDU faculty presents research on electronics cooling at int’l conference

Prof Eswaramoorthy being greeted with a souvenir at College of Engineering in Adoor area of Kerala.
Prof Eswaramoorthy being greeted with a souvenir at College of Engineering in Adoor area of Kerala.

Excelsior Correspondent

JAMMU, May 14: Prof Eswaramoorthy Muthusamy from the School of Mechanical Engineering, Shri Mata Vaishno Devi University (SMVDU), presented his research paper at an international conference on “Recent Trends in Mechanical Engineering” held at the College of Engineering, Adoor, Kerala.
The event, organized by the Department of Mechanical Engineering (NBA-accredited), brought together renowned experts and researchers from prestigious institutions such as National Taiwan University, University of Warwick (UK), IIT Madras, IIT Mumbai, NITs, Oak Ridge National Laboratory (USA), Robert Bosch (Germany), and others.
Prof Eswaramoorthy’s research paper, titled “Recent Development in Thermal Management of Modern Electronics Devices,” discussed the need for efficient heat management in compact and high-performance electronic devices. His study reviewed current strategies in thermal control, challenges faced in the field, and future possibilities.
As electronic devices become smaller and more powerful, they are prone to overheating.
Prof Eswaramoorthy highlighted solutions like the use of advanced materials (graphene, CNTs, PCMs), micro/nanoscale cooling technologies, smart AI-driven thermal systems, and flexible cooling techniques suitable for wearable tech.
His presentation drew special attention to the use of flexible phase change materials to prevent overheating, which can otherwise lead to device failure.
Besides presenting his paper, Prof Eswaramoorthy also served as the technical chair for one of the sessions, moderating discussions among global experts.
The participation of Prof Eswaramoorthy in this international event further strengthened SMVDU’s presence in cutting-edge interdisciplinary research related to electronics and mechanical engineering.