NEW DELHI, Mar 10: India and US on Friday signed a Memorandum of Understanding (MoU) for establishing a collaborative mechanism on semiconductor supply chain resiliency and diversitication.
The MoU seeks to establish a collaborative mechanism between the two Governments on Semiconductor Supply chain resiliency and diversification in view of US’s CHIPS and Science Act and India’s Semiconductor Mission, an official statement said.
The MoU aims to leverage complementary strengths of both countries and facilitate commercial opportunities and development of semiconductor innovation ecosystems through discussions on various aspects of semiconductor value chain.
It envisages mutually beneficial R&D, talent and skill development, the statement said.
(UNI)
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