Excelsior Correspondent
JAMMU, Feb 1: The two-day Indo-Taiwan Conference on Semiconductor Packaging and Testing was inaugurated at SASTRA Deemed University, in collaboration with Lunghwa University of Science & Technology and supported by SPARC, Ministry of Education, Government of India.
The conference was inaugurated by Prof Rao R Tummala, a pioneer in the semiconductor industry, known for his contributions to the LTCC, glass packaging, and plasma display technologies. Prof Tummala, widely regarded as the Father of Modern Packaging (IEEE), delivered a keynote address on the global transition from System-on-Chip (SoC) to System-on-Package (SoP). He also discussed his model of establishing Industry Co-development Centres (ICCs) worldwide, which he aims to replicate in India to accelerate its semiconductor sector.
Prof S Vaidhyasubramaniam, Vice-Chancellor, SASTRA Deemed University, welcomed the gathering and underscored the ongoing academic and research collaborations between SASTRA and Taiwanese Universities. A Memorandum of Understanding (MoU) was signed between SASTRA Deemed University and PTW Semiconductor India Pvt. Ltd and was exchanged by Prof R Chandramouli, Registrar, SASTRA and Venkatesh Kumar Pandurengan, General Manager, PTW Semiconductors India Pvt. Ltd. The Principal Investigators of the SPARC project, Prof Po-Hsueh Chang, Department of Semiconductor Engineering, Lunghwa University of Science & Technology and Dr R John Bosco Balaguru, SASTRA Deemed University, were present at the inauguration ceremony.
Eminent speakers from the semiconductor industry and academia in India and Taiwan delivered keynote and invited talks during the conference. The event witnessed active participation from more than 140 delegates representing 20 industries and 25 academic institutions who engaged in meaningful interactions with domain experts. The two-day conference concluded with closing remarks by Dr S Lenin Prakash, Co-Convener of the event.
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